ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,805, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices including channel laye... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,806, issued on Aug. 25, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Memory, gate-all-around field-effect transistor, ... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,807, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Gate dielectric layers for stac... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,808, issued on Aug. 25, was assigned to Zinite Corp. (Edmonton, Canada). "Source/drain channel interface with nitrogen-containing oxide" wa... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,809, issued on Aug. 25, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Kanagawa-ken, Japan). "Metal oxide, formation method of m... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,810, issued on Aug. 25, was assigned to Hon Young Semiconductor Corp. (Hsinchu City, Taiwan). "Semiconductor device and forming method ther... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,811, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Lightly-doped channel extension... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,813, issued on Aug. 25, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Semiconductor power device with improved ruggedness" was in... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,814, issued on Aug. 25, was assigned to Magnachip Semiconductor Ltd. (Cheongju-si, South Korea). "Fast recovery diode and method for manufa... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,815, issued on Aug. 25, was assigned to Silanna Asia Pte Ltd (Singapore). "Power device integration on a common substrate" was invented by ... और पढ़ें